Author
Paradigm
References
Research

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Markets for Micro Abrasive Waterjets

1. Machining and Revenue Potential

Micro abrasive waterjets (MAWs) bring to micro machining the benefits that AWJs have established in general machining. These include the ability to machine a wider range of materials than other machining method and to produce parts with minimal programming and set up times.

Fine abrasive waterjets (FAWs) bridge the gap between MAWs with diameters of 50 microns and less and AWJs with diameters over 300 microns. For simplicity, markets are discussed only in relation to MAWs. AWJ manufactures and users are already aware of markets for FAWs because of many request to machine workpieces that require smaller diameter jets than can be generated by AWJs.

MAWs will compete against as well as complement micro machining lasers. This is the same competitive and complementary position AWJs have with regards to general machining lasers. Micro machining laser sales revenues are growing to match those from lasers for general machining. It can, therefore, be expected that MAW based machining system sales revenues will grow towards those from AWJs.

AWJs are superb machine tools for small job shops, with an estimated 40% of AWJ machining systems operated by businesses with under ten employees. The potential for MAWs in small job shops and for hobby use is even greater as individuals can operate desktop sized MAW machining systems from a domestic site.

Laser job shops are major purchasers of AWJs. A micro machining laser job shop with an abrasive waterjet can attract a broader customer base through the range of materials it can process.

2. Micro Machining Methods

Micro machining methods for cutting, profiling, drilling and slotting are summarized in Annex 1. Of the non-conventional machining methods lasers have the largest share. Investment in laser R&D probably exceeds that of all other micro machining methods combined. The capabilities of lasers are continuously being extended and new cutting-beam generation modes commercially exploited. MAWs will mainly compete with and complement micro machining lasers so this Web page is devoted to comparison of the two methods.

Waterjets and lasers are power beams. An energetic beam is directed at a workpiece and manipulated to cut, profile, drill and slot. Abrasive waterjets have energy densities of 20 kW/mm² or so compared to 100-1000 kW/mm² for lasers. Most micro machining lasers operate in pulse mode with energy densities that can reach over 10 MW/mm² for femtosecond lasers. For applications where the power of a laser can be used, a laser will cut faster than an abrasive waterjet.

Speed of cut is only one of many considerations in micro machining. What is often required is the ability to do the job, to the quality required, within a specified time, at an acceptable price. When small batches of components need machining, access to a machining centre that is capable of doing the job is usually more important than machining time.

3. Markets for MAWs

The great diversity of micro machining applications means that only a few percent of potential applications for MAW machining systems units are currently known. This is the usual situation for a new machining technology. This will change as awareness of the capabilities of micro abrasive waterjets filters through to product designers and production engineers.

Initially the main applications will be the cutting, profiling, slotting and drilling of materials less than about 1mm thick. Applications include:

  • Thin materials that distort or crack when profiled and drilled by AWJs
  • Components produced from thin sheet metals, such as flat springs, electronic packaging and EMC shielding
  • Glass and other brittle materials that are difficult to cut and drill. A particular area is glass substrates in the electronics industry that need to be drilled and slotted.
  • Pre-forms cut from high value solders and braze materials, particularly for small batches where the production of hard tooling makes items expensive
  • Miniature components, particularly in hard to machine materials such as shape memory alloys
  • Jewellery and high value materials where minimum cut width is required
  • Slotted and drilled screens that cannot be produced with lasers because of heat affects, or distortion, or materials not suitable for lasers
  • Processing foil materials down to a few tens of microns in thickness
  • Free-shape cutting of semiconductor wafers
  • Cutting of components in a college and university environments, particularly for training sessions where items are designed and produced in a single teaching session
Machining capabilities, ease of use, reliability and acceptable cost of ownership and operation will be key factors in determining the market size for MAWs. Of particular importance will be designing desktop machining systems for small workshops, commercial and educational establishments.

4. Marketing

The development of the laser micro machining market is the best model of how to build a user base of MAW machining systems. Companies in the laser micro machining industry have sought to find “killer applications” that could generate substantial revenues. No such applications have been found but the industry has grown revenues to over a billion US dollars from diverse applications for micro machining lasers.

The lesson is that micro machining lasers are general-purpose cutting tools and volume sales come from developing machining systems for diverse markets. MAWs are also general-purpose cutting tools that can be integrated into a wide range of machine systems to meet diverse micro machining needs.

Small businesses made a major contribution to the growth of the market for micro machining lasers. Individuals saw the potential of the technology in attracting premium priced jobs, from a diverse and widely spread customer base, and they could live with the teething problems of a new technology. Single person and small businesses are likely to be particularly attracted to MAW machining systems as the investment for a unique machining capability will be modest.

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Annex A: MICRO MACHINING METHODS

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Method

Typical Materials

Comments

Conventional machining
Metals, ceramics, polymers

Lathes, micro milling and drilling machines, etc. - not normally suitable for drilling holes less than 100 microns in diameter

Micro EDM Conductive materials - metals, silicon Features with 20:1 aspect ratio and 10 micron detail. Wire EDM wire diameters down to 20 microns.

Lasers

Nd:YAG
Most metals, ceramics, diamond Drill and cut down to 10microns
Eximer
Polymers, silicon Good at large area precision etching, Drill and cut down to 2 microns - slow
Copper Vapour
Metals, ceramics Drill and cut down to 2 microns with aspect ratio >20
Femtosecond
Metals, plastics, ceramics Drill and cut down to 2 microns with aspect ratio > 10. Cold cutting
Photo etching
Metals Feature aspect ratio limited to 1:1, good for production series
Fine pressing Metals, plastics Hard tooling required so benefits come from production series
Ion beam Metals, silicon, inorganic materials Operates down to the nanometer regime - Expensive
Electron beam Metals, ceramics High drilling rate of holes up to 25:1 aspect ratio
Diamond saw Metals, ceramics, silicon Effective technology for straight cuts
Widely used in electronics industry
Air abrasive Brittle materials Masks usually required
Electrochemical machining Metals Hard tooling or electrodes
Ultrasonic abrasive
Plastics, ceramics, thin metals Hard tooling required

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